KIN Kingston Technology FURY 16GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

Product image of KIN KF432S20IBK2/16
  • Product image of KIN KF432S20IBK2/16 1
  • Product image of KIN KF432S20IBK2/16 2
  • Product image of KIN KF432S20IBK2/16 3
  • Product image of KIN KF432S20IBK2/16 4
  • Product image of KIN KF432S20IBK2/16 5
  • Product image of KIN KF432S20IBK2/16 6
  • Product image of KIN KF432S20IBK2/16 7
  • Product image of KIN KF432S20IBK2/16 8
  • Product image of KIN KF432S20IBK2/16 9
  • Product image of KIN KF432S20IBK2/16 10
  • Product image of KIN KF432S20IBK2/16 11

Pildid on illustratiivsed. Nendel kujutatud toode võib erineda pakutavast või sisaldada tootekomplekti mittekuuluvaid osiseid.

VendorKIN
Product codeKF432S20IBK2/16
Warranty Lifetime
Price€174.90
Price (excl. VAT)€141.05
Delivery 3-5 workdays
Quantity3 pcs
Inbank
Telia
ESTO

Inbank financing calculator

NB! Järelmaks on finantskohustus,
millega kaasnevad kulud. Tutvu tingimustega siin.

Telia financing calculator

NB! Järelmaks on finantskohustus,
millega kaasnevad kulud. Tutvu tingimustega siin.

ESTO financing calculator

NB! Järelmaks on finantskohustus,
millega kaasnevad kulud. Tutvu tingimustega siin.

Ships quicker

Programming power voltage (VPP):
2.5 V
Memory layout (modules x size):
2 x 8 GB
Row cycle time:
45.75 ns
JEDEC standard:
Yes
Row active time:
26.25 ns
Memory data transfer rate:
3200 MT/s
Intel Extreme Memory Profile (XMP) version:
2.0
Buffered memory type:
Unregistered (unbuffered)
Memory voltage:
1.2 V
CAS latency:
20
Module configuration:
1024M x 64
Refresh row cycle time:
350 ns
Cooling type:
Heatsink
Internal memory:
16 GB
Internal memory type:
DDR4
ECC:
No
Component for:
Laptop
Intel Extreme Memory Profile (XMP):
Yes
Memory form factor:
260-pin SO-DIMM
Backlight:
No
Operating temperature (T-T):
0 - 85 °C
Storage temperature (T-T):
-55 - 100 °C
Height:
30 mm
Depth:
69.6 mm
Width:
3.8 mm
Weight:
16.6 g
Harmonized System (HS) code:
84733020
Warnings:
Keep out of the reach of children., Disposal of electronic products should be in accordance with local regulations for the recycling of electronic equipment., Do not disassemble or damage the memory modules, they may contain substances hazardous to health.

Send link to friend