KIN Kingston Technology FURY 32GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP

Product image of KIN KF556S40IBK2-32
  • Product image of KIN KF556S40IBK2-32 1
  • Product image of KIN KF556S40IBK2-32 2
  • Product image of KIN KF556S40IBK2-32 3
  • Product image of KIN KF556S40IBK2-32 4
  • Product image of KIN KF556S40IBK2-32 5
  • Product image of KIN KF556S40IBK2-32 6
  • Product image of KIN KF556S40IBK2-32 7
  • Product image of KIN KF556S40IBK2-32 8
  • Product image of KIN KF556S40IBK2-32 9
  • Product image of KIN KF556S40IBK2-32 10
  • Product image of KIN KF556S40IBK2-32 11
  • Product image of KIN KF556S40IBK2-32 12
  • Product image of KIN KF556S40IBK2-32 13
  • Product image of KIN KF556S40IBK2-32 14
  • Product image of KIN KF556S40IBK2-32 15
  • Product image of KIN KF556S40IBK2-32 16
  • Product image of KIN KF556S40IBK2-32 17
  • Product image of KIN KF556S40IBK2-32 18
  • Product image of KIN KF556S40IBK2-32 19

Pildid on illustratiivsed. Nendel kujutatud toode võib erineda pakutavast või sisaldada tootekomplekti mittekuuluvaid osiseid.

VendorKIN
Product codeKF556S40IBK2-32
Warranty Lifetime
Price€163.90
Price (excl. VAT)€132.18
Delivery Out ouf stock

Ships quicker

On-Die ECC:
Yes
Memory data transfer rate:
5600 MT/s
SPD profile:
Yes
Programming power voltage (VPP):
1.8 V
JEDEC standard:
Yes
Component for:
Laptop
ECC:
No
Module configuration:
2048M x 64
Refresh row cycle time:
295 ns
Memory form factor:
262-pin SO-DIMM
Intel Extreme Memory Profile (XMP) version:
3.0
Lead plating:
Gold
Intel Extreme Memory Profile (XMP):
Yes
Row active time:
28.56 ns
Row cycle time:
48 ns
Memory layout (modules x size):
2 x 16 GB
Cooling type:
Heatsink
Memory voltage:
1.1 V
CAS latency:
40
Buffered memory type:
Unregistered (unbuffered)
Internal memory:
32 GB
Internal memory type:
DDR5
Operating temperature (T-T):
0 - 85 °C
Storage temperature (T-T):
-55 - 100 °C
Width:
3.8 mm
Depth:
69.6 mm
Weight:
16.8 g
Height:
30 mm
Warnings:
Disposal of electronic products should be in accordance with local regulations for the recycling of electronic equipment., Keep out of the reach of children., Do not disassemble or damage the memory modules, they may contain substances hazardous to health.

Send link to friend