Nedis COOLP400SI Thermal paste 4g
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This high-performance CPU thermal paste is designed to provide efficient heat transfer between the processor and the cooling system. With thermal conductivity of 4.63 W/mK, it ensures stable temperatures even under heavy workloads. The paste maintains its properties at temperatures up to 300 °C, making it suitable for high-performance CPUs, GPUs, and other heat-generating components. Its low thermal resistance (< 0.01 °C) improves cooling efficiency, while the 4-gram volume is sufficient for multiple applications. Ideal for both professional and home PC assembly.
Technical Specifications:
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Product type: Thermal paste
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Application: CPU / GPU / electronic components
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Thermal conductivity: 4.63 W/mK
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Thermal resistance: < 0.01 °C
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Operating temperature range: up to 300 °C
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Net weight: 4 g
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Colour: Grey
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Electrical conductivity: Non-conductive
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Consistency: Paste
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Intended use: Desktop and laptop computers


